A short-depth, front-accessible 1U single-socket server ruggedized with NEBS Level 3 compliance and purpose-built for telco — Intel® Xeon® 6 SoC processors with Intel vRAN Boost, 8x25GbE onboard networking, optional GNSS precision timing, and HPE iLO 7 for communication service providers' 5G edge deployments.
Need a ruggedized 1U server that lives at the cell site or network edge, not just in a climate-controlled data center?
The HPE ProLiant Compute DL110 Gen12 is customized for edge applications requiring high bandwidth and low latency, such as vRAN and the 6G future. Its reduced footprint features a compact, short-depth, 1U/1P front-accessible chassis ruggedized with NEBS Level 3 compliance for harsh environments, with reverse (front-to-rear) airflow and a front-cabled design. Delivering the trusted HPE ProLiant experience with embedded HPE iLO 7 management and security through the HPE silicon root of trust, it is ready for communication service providers' 5G edge deployments.
This is the telco/edge choice in the Gen12 1U lineup: if you need general-purpose 1U compute for a standard rack, look at the DL320 Gen12 (Intel) or DL325 Gen12 (AMD) instead — the DL110 is for NEBS-compliant, space- and power-constrained telco and edge sites.
| Form factor | 1U rack, single-socket (1P), short-depth front-cabled chassis with reverse (front-to-rear) airflow; NEBS Level 3 ruggedized |
|---|---|
| Processor | Intel Xeon 6 SoC — 6716P-B: 40 cores, 2.1 GHz, 160 MB L3, 235 W; Intel vRAN Boost, media acceleration, and AMX in every core |
| Memory | 4 DIMM slots (4 channels, 1 DIMM per channel), up to 512 GB HPE DDR5 Smart Memory RDIMM at 6400 MT/s |
| Storage | 2 x M.2 NVMe SSD on the motherboard (up to 3.84 TB as 2 x 1.92 TB); Intel VROC software RAID 0/1 |
| Networking | 8x25GbE onboard; up to 20 10/25 GbE ports; PCIe and OCP adapter options from 1GbE to 100GbE |
| Precision timing | Optional M.2 GNSS receiver module and M.2 DPLL timing module with up to 4-hour Digital Phase Lock Loop |
| Expansion | 2 x PCIe 5.0 x16 full-height half-length riser slots, or OCP 3.0 options (x16 DSFF and x16 SFF) |
| Cooling | 8 dual-rotor hot-plug fans, individually serviceable |
| Power | 1300W M-CRPS Titanium (96%) hot-plug AC or 1000W -48VDC power supplies, both reverse airflow |
| Management & security | HPE iLO 7, HPE Compute Ops Management, Silicon Root of Trust, O-RAN security support |
Download datasheet: HPE ProLiant Compute DL110 Gen12 QuickSpecs (HPE.com)
The compact, short-depth, front-accessible 1U/1P chassis is ruggedized with NEBS Level 3 compliance for harsh environments such as cell sites and edge closets. Reverse (front-to-rear) airflow, front cabling, hot-plug fans and power supplies, and a -48VDC power option make it serviceable and deployable where standard rack servers are not.
Intel Xeon 6 SoC processors integrate Intel vRAN Boost, media acceleration, and networking on the chip, with Intel Advanced Matrix Extensions (AMX) in every core delivering up to a 3.2x increase in RAN AI performance per core — dense I/O at PCIe Gen5 speed for high-bandwidth, low-latency edge applications like vRAN and the 6G future.
An optional HPE Global Navigation Satellite System (GNSS) receiver module and M.2 DPLL timing module provide precision time with up to a four-hour Digital Phase Lock Loop holdover — the timing foundation vRAN and O-RAN radio networks depend on.
Embedded HPE iLO 7 management with the HPE Silicon Root of Trust anchors firmware integrity at the silicon level, and O-RAN security support extends that trusted ProLiant experience to open RAN infrastructure. Manage fleets from edge to cloud with HPE Compute Ops Management.
Tell us about your vRAN, 5G edge, or NEBS-compliant site requirements and a ServerComputeWorks specialist will help you spec, price, and order the right DL110 Gen12 build.
Request a Quote*Intel, Intel Xeon, and Intel vRAN Boost are trademarks of Intel Corporation or its subsidiaries. All other third-party trademark(s) is/are property of their respective owner(s). Typical NEBS certification is 90 days post-production manufacture. Specifications and availability are subject to change.